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JK ELECTRONICS

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Technical·Facility Status

Technical Status

  • 스피드 홈
  • Technical·Facility Status
  • Technical Status

Build-Up PCB

Because of the product enhancement of high integration, PCBs are processed into fine laser drills beyond the limitations of conventional mechanical drills.
This product can be designed in various ways with the free configuration of the drill position according to each layer.

  • A-TYPE

  • B-TYPE

  • C-TYPE

  • D-TYPE

A-TYPE B-TYPE C-TYPE D-TYPE
CNC 1-10 1-10, 2-9 1-10, 2-9 1-10, 3-8
Laser 1-2, 9-10 1-2, 9-10 1-2, 2-3, 8-9, 9-10 1-2, 2-3, 8-9, 9-10
Stacking count 1TIME 2TIME 2TIME 3TIME

Specification

Item Capability
No. of Layer 4~12
Board Thickness 0.4T~1.6T
Min Line Width / Space 0.07mm/0.07mm
Min DrILL / Pad 0.2mm/0.4mm
Min Laser Drill / Pad 0.1mm/0.25mm

H D I

A method of processing PCBs one at a time by laminating them one at a time using a laser drill (Laser VIA Fill Plating Process)

  • VF-1

  • VF-2

  • VF-3

  • Any VIA

VF-1 VF-2 VF-3 Any VIA
CNC 1-10, 2-9 1-10, 3-8 1-10, 4-7 1-10, 3-8
Laser 1-2, 2-3, 8-9, 9-10 1-2, 2-3, 8-9, 9-10 1-2, 2-3, 4-5, 7-8, 8-9, 9-10 Any Drilling
Laser 1TIME 2TIME 2TIME 3TIME
Laser VIA Fill 1TIME 2TIME 2TIME 3TIME

Specification

Item Capability
No. of Layer 4~12
Board Thickness 0.4T~1.6T
Min Line Width / Space 0.05mm/0.05mm
Min DrILL / Pad 0.1mm/0.25mm
Min Laser Drill / Pad 0.08m/0.20mm

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